Quectel 5G M.2 Module Development Board EVB Kit (QTMR0021ZJ)

Quectel 5G M.2 Module Development Board EVB Kit (QTMR0021ZJ)

This development board can be used with Quectel 5G modules in M.2 form factor, such as Quectel RM500Q-GL, Quectel RM500Q-CN, Quectel RM510Q-GL, Quectel RM500U-CN etc...

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Fibocom and MediaTek Collaborate to Demonstrate FG370 Module with Modem AI and 3Tx+L4S

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  On March 5, during the 2025 Mobile World Congress (MWC Barcelona 2025), Fibocom and MediaTek jointly demonstrated the technical performance of the FG370 module based on the MediaTek T830 platform, featuring Modem AI and 3Tx (3-antenna transmission) + L4S (Low Latency, Low Loss, and Scalable Throughput). These features meet the product development needs of global leading operators for 5G FWA (Fixed Wireless Access) and MiFi (Mobile Broadband) in their respective application scenarios, including precise network prediction, intelligent network selection strategies, and optimized air interface performance. Fibocom FG370 , equipped with MMAI (MediaTek Modem AI), significantly enhances network connection efficiency in four weak-signal scenarios: high-speed railways, underground environments, airports, and remote suburban areas. In airports, AI-driven network prediction improves network search speed by over 50%. In outdoor mobile scenarios, MMAI provides an AI hiking mode, optimizing we...
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Quectel's High-End 5G Smart Module SG560D-NA First to Receive PTCRB Certification

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  Recently, Quectel announced that its high-end   5G Smart module   SG560D-NA, based on the Qualcomm QCM6490 platform, has successfully received PTCRB certification. Prior to this, the module also obtained certifications from the US FCC and Canada’s IC, indicating that it fully meets the standards and regulations for North America. This ensures efficient and stable operation of related smart devices in the region, aiding customers in rapidly expanding into the North American market. High-End 5G Performance Leader The  Quectel SG560D-NA , developed on the Qualcomm QCM6490 platform, features a high-performance octa-core 64-bit processor and an integrated Qualcomm Adreno™ 643 GPU (high-performance graphics engine), with a combined computing power of up to 14 TOPS. It offers efficient edge computing capabilities and rich multimedia features. Thanks to the dedicated NPU of the Qualcomm QCM6490 platform, the module achieves an optimal balance between performance and power ...
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Quectel 5G RedCap Module RG255C-GL Passes Certification from Two Major North American Operators

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  Recently, Quectel’s 5G RedCap module   RG255C-GL   achieved another milestone by successfully passing the certification from two major North American operators. This certification marks that the module now fully meets the high standards of North American carriers, offering more efficient and reliable RedCap connectivity to local users, further strengthening Quectel’s competitive edge in the global IoT market. Technological Innovation: Lightweight 5G Empowering Vertical Industries The  Quectel RG255C-GL module  is based on the Qualcomm® Snapdragon® X35 platform and is equipped with 5G RedCap technology, specifically designed for high-speed IoT scenarios. As a lightweight 5G technology defined by the 3GPP R17 standard, RedCap reduces the number of terminal antennas, lowers modulation complexity, and decreases bandwidth requirements. While retaining key 5G benefits like low latency, high reliability, and network slicing, it significantly optimizes device cost, si...
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